The latest 2025 revision of the Dual-Use Items and Technologiesimport and exportLicense Control Catalog includes sub-14nm process equipment under control, requiring special attention from importersAccuracy of HS Code Classification. In our wafer fab case study, we found that if the equipment control cabinet contains a temperature sensor module (Item 3B001.b), the entire machines filing materials require additionalFinal user statementandEnd-Use Certificate.
High-precision semiconductor equipment transportation requires configurationConstant Temperature and Humidity Container(temperature fluctuation ±0.5°C/humidity ±3%RH). In a 12-inch wafer dicing machine import case, we improved equipment unboxing qualification rate to 98% through the following measures:
A memory chip manufacturer optimized import processes, achievingOverall customs clearance time reduced by 22%Core experience includes:
A specific case showed that adoptingBatch-by-batch customs clearancestrategy for a $30 million equipment import project successfully avoided $1.26 million in guarantee deposits by reasonably splitting into 28 HS code declaration units. This requires agency service providers to possessElectromechanical product classification prediction systemandTariff optimization simulation systemand other professional tools.
Notably, the latest development is the EUs equipment energy efficiency grading system (SEMI S23 standard) to be implemented in 2025, requiring importers to prepare in advanceEnergy consumption test reports(EN 50640 certification). Professional agencies should provide complete solutions from document preparation to testing institution coordination.
? 2025. All Rights Reserved. Shanghai ICP No. 2023007705-2 PSB Record: Shanghai No.31011502009912